ISTFA 2021 (Paperback)

Language: English

Published by A S M International, Materials Park, OH, 2022

1627084193 / 9781627084192

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Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail

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Paperback. The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; scanning probe analysis; hardware attacks, security, and reverse engineering; microscopy and material characterization; nanoprobing and electrical characterization; and more.In the 21st century, the electronic market will be driven by consumers with demands of immediate entertainment, fast access to information, and communications anywhere in a personalized fashion and at affordable prices. The new challenge is not how many transistors can be built on a single chip, as in System-on-Chip (SoC), but rather how to integrate diverse circuits together predictably, harmoniously, and cost effectively. Instead of getting twice the transistors for the same cost as Moore's Law predicted in the past 50 years, the goal of SiP is to obtain the same number of transistors for half the cost within less than half the time to market. The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Seller Inventory # 9781627084192

Title
ISTFA 2021 (Paperback)
Author
ASM International
Publisher
A S M International, Materials Park, OH
Publication year
2022
Condition
new
Binding
Paperback
Language
English
ISBN 10
1627084193
ISBN 13
9781627084192

Grand Eagle Retail

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