High temperature resistant connection materials. processes and reliability of wide bandgap semiconductor devices(Chinese Edition)

Language: Chinese

Published by Mechanical Industry Press, 2022

7111709535 / 9787111709534

  • Softcover
  • New
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Seller: liu xing, Nanjing, JS, Chinaliu xing

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Softcover

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Item description from seller

Language:Chinese.Paperback. Pub Date: 2022-08-01 Pages: 248 Publisher: Mechanical Industry Press Traditional solder alloys have been widely used in the microelectronics industry. but solder alloys can no longer meet the third-generation wide bandgap High temperature application requirements for semiconductor (silicon carbide and gallium nitride) devices. The new silver sintering/copper sintering technology and transient liquid phase bonding technology are the key technologies to realize the r.

Seller Inventory # NY043160

Title
High temperature resistant connection materials. processes and reliability of wide bandgap semiconductor devices(Chinese Edition)
Author
[ MA LAI XI YA ] XIAO JING XIONG ( Kim S.Siow )
Publisher
Mechanical Industry Press
Publication year
2022
Condition
New
Binding
paperback
Language
Chinese
ISBN 10
7111709535
ISBN 13
9787111709534

liu xing

Nanjing, JS, China

5-star seller

AbeBooks seller since April 7, 2009

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