High performance and low power on-die interconnect fabrics

Language: English

Published by LAP LAMBERT Academic Publishing Aug 2012, 2012

3659211214 / 9783659211218

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Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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Softcover

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This item is printed on demand - Print on Demand Titel. Neuware -Technology scaling has made billion transistors design feasible on a single die. With transistors getting cheaper and faster, the core count in multi-processor systems has been steadily increasing. High end servers, gigabit Ethernet routers and multimedia processors now serve workloads dealing with terabytes of data flow every second. Even medium throughput applications now prefer multi-core architectures over a single core implementation for better energy efficiency and fault tolerance. These system need a network to communicate data among processing and storage elements in the chip. Although processing units are getting smaller and simpler, the dramatic rise of their number in a single die has resulted in the growing complexity of interconnect.Hence, the design paradigm for multi-core chips is gradually shifting from a core-centric architecture towards an interconnect-centric architecture, where overall system performance is limited by the bandwidth of the interconnect fabric rather than the processing ability of any individual core. This work is an attempt to analyse the challenges resulting from this paradigm shift and address them with circuit and architectural innovations.OmniScriptum SRL, Str. Armeneasca 28/1, office 1, 2012 Chisinau 152 pp. Englisch.…

Seller Inventory # 9783659211218

Title
High performance and low power on-die interconnect fabrics
Author
David Blaauw
Publisher
LAP LAMBERT Academic Publishing Aug 2012
Publication year
2012
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3659211214
ISBN 13
9783659211218
Item weight
244 grams
Dimensions
220x150x10 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

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