High-Bandwidth Memory Interface

Language: English

Published by Springer, Palgrave Macmillan Nov 2013, 2013

3319023802 / 9783319023809

Series: Book 45 of 209 - SpringerBriefs in Electrical and Computer Engineering

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This item is printed on demand - Print on Demand Titel. Neuware -This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 96 pp. Englisch.

Seller Inventory # 9783319023809

Title
High-Bandwidth Memory Interface
Author
Chulwoo Kim
Publisher
Springer, Palgrave Macmillan Nov 2013
Publication year
2013
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3319023802
ISBN 13
9783319023809
Item weight
160 grams
Dimensions
235x155x6 mm
Series
Book 45 of 209: SpringerBriefs in Electrical and Computer Engineering

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

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AbeBooks seller since January 23, 2017

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Impressum Thorsten Retsch Buchversand Mimpf2000 Oberölschnitz 16 95517 Emtmannsberg Deutschland Telefon: 09209-2023188 Email: mimpf2000@online.de USt-ID-Nr.: DE 235096871 Wir führen gebrauchte Bücher aus allen Sparten der Literatur

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