Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)
Karl J. Puttlitz & Kathleen A. Stalter
ISBN 10: 0824748700 ISBN 13: 9780824748708
Published by CRC Press, 2004
Used
Hardcover
From
Salish Sea Books, Bellingham, WA, U.S.A.
Seller rating 5 out of 5 stars
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About this Item
Description:
Good++; Hardcover; Covers are clean and glossy; Couple of small spot-marks to the right textblock, otherwise unblemished textblock edges; Name on the front endpaper, otherwise endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, 9.75" - 10.75" tall); 4.3 lbs; Green covers with title in black lettering; 2004, CRC Press; 1048 pages; "Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)," by Karl J. Puttlitz & Kathleen A. Stalter. Seller Inventory # SKU-1007AC02403205
Synopsis:
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
About the Author: Karl J. Puttlitz, Kathleen A. Stalter
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Bibliographic Details
Title: Handbook of Lead-Free Solder Technology for ...
Publisher: CRC Press
Publication Date: 2004
Binding: Hardcover
Condition: Good