Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. This item is unavailable.
Language: English
Published by Taylor & Francis Group, 2004
- Hardcover
- New
Seller: Biblios, frankfurt am main, hessen, GermanyBiblios
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Hardcover
Condition: New
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Item description from seller
pp. xi + 1026.
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- Title
- Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
- Author
- Stalter Kathleen A. Puttlitz Karl J.
- Publisher
- Taylor & Francis Group
- Publication year
- 2004
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0824748700
- ISBN 13
- 9780824748708
- Series
- Book 71 of 115: Mechanical Engineering
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
"Synopsis" may belong to another edition of this title.
About the Author
Karl J. Puttlitz, Kathleen A. Stalter
"About the title" may belong to another edition of this title.