HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)

Language: English

Published by World Scientific Publishing Co Pte Ltd, Singapore, 1996

9810223072 / 9789810223076

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Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

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Title
HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Author
Paul D. Franzon
Publisher
World Scientific Publishing Co Pte Ltd, Singapore
Publication year
1996
Condition
new
Binding
Hardcover
Language
English
ISBN 10
9810223072
ISBN 13
9789810223076

AussieBookSeller

Truganina, VIC, Australia

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AbeBooks seller since June 22, 2007

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The Nile Group Pty Ltd

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Truganina, VIC Australia 3029