Grid-Based Problem Solving Environments: IFIP TC2/WG2.5 Working Conference on Grid-Based Problem Solving Environments: Implications for Development and Deployment of Numerical Software, July 17-21, 2006, Prescott, Arizona, USA (Volume 239)
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ISBN 10: 0387736581 ISBN 13: 9780387736587
Published by Springer, 2007
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2007. 2007th Edition. hardcover. . . . . . Seller Inventory # V9780387736587
Synopsis:
This volume presents the proceedings of the IFIP TC2 WG 2.5 Conference on Grid-Based Problem Solving Environments: Implications for Development and Deployment of Numerical Software, held in Prescott, Arizona from July 17-21, 2006. The book contains the most up-to-date research on grid-based computing. It will interest users and developers of both grid-based and traditional problem solving environments, developers of grid infrastructure, and developers of numerical software.
From the Back Cover:
International Federation for Information Processing
The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.
For more information about the 300 other books in the IFIP series, please visit www.springer.com.
For more information about IFIP, please visit www.ifip.org.
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Bibliographic Details
Title: Grid-Based Problem Solving Environments: ...
Publisher: Springer
Publication Date: 2007
Binding: Hardcover
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