Grain Structures & Effects of Stress on Grain Boundaries

Language: English

Published by LAP LAMBERT Academic Publishing Jul 2018, 2018

6139877873 / 9786139877874

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space. 68 pp. Englisch.

Seller Inventory # 9786139877874

Title
Grain Structures & Effects of Stress on Grain Boundaries
Author
Manvinder Sharma
Publisher
LAP LAMBERT Academic Publishing Jul 2018
Publication year
2018
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
6139877873
ISBN 13
9786139877874
Item weight
119 grams
Dimensions
220x150x5 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

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BuchWeltWeit Ludwig Meier e.K.

Germany