Flip-Chip and Underfill Materials and Technology (Encyclopedia of Packaging, Materials, Processes and Mechanics: Set 1, Volume 1)

Published by World Scientific Publishing, 2020

ISBN 10: 9811201129 (ISBN 13: 9789811201127)

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Seller: The Mighty Book, Portland, OR, U.S.A.The Mighty Book

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Gently read hardcover, with clean text, very good pictorial binding. Ready to ship.

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Bibliographic details

Title
Flip-Chip and Underfill Materials and Technology (Encyclopedia of Packaging, Materials, Processes and Mechanics: Set 1, Volume 1)
Author
Zhu, Pengli, and Li, Gang, and Wong, CP
Publisher
World Scientific Publishing
Publication year
2020
Condition
Very Good
Binding
Hardcover
Item weight
2 pounds

The Mighty Book

Portland, OR, U.S.A.

5-star seller

AbeBooks seller since April 8, 2024

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