Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)

[ MEI ] BEI SI&amp#183; KAI SE ( Beth Keser ) . [ DE ] SI DI FEN&amp#183; KE LUO NA TE

ISBN 10: 7111755804 ISBN 13: 9787111755807
Published by Mechanical Industry Press, 2024
Language: English
Condition: New Soft cover

Sold by liu xing, Nanjing, JS, China

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