Electrothermal Analysis of VLSI Systems
Language: English
Published by Humana, 2013
- Softcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
AbeBooks seller since August 14, 2006
Condition: New
£ 99.79
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Add to basketItem description from seller
nach der Bestellung gedruckt Neuware - Printed after ordering - Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Seller Inventory # 9781475773736
- Title
- Electrothermal Analysis of VLSI Systems
- Author
- Ching-Han Tsai
- Publisher
- Humana
- Publication year
- 2013
- Condition
- Neu
- Binding
- Taschenbuch
- Language
- English
- ISBN 10
- 1475773730
- ISBN 13
- 9781475773736
- Item weight
- 371 grams
- Dimensions
- 235x155x14 mm
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
"Synopsis" may belong to another edition of this title.
Review
`Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices.'
Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation
"About the title" may belong to another edition of this title.
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