Electronics Engineers growth path: Cadence high-speed circuit board design and practice(Chinese Edition)

ZHOU RUN JING . ZHAO JIAN KAI

ISBN 10: 7121152517 / ISBN 13: 9787121152511

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Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date: 2013 Pages: 353 Language: Chinese in Publisher: Publishing House of Electronics Industry Electronics Engineers growth path: Cadence high-speed circuit board design and practice Cadence AHegro SPB 16.5 basis. starting from the point of view of design practice specific circuit example. the normal design process for the order. progressive approach to explain the components built library PCB design. schematic design. layout. wiring. rule set. and post-processing PCB design process. The contents of the the Electronics Engineers growth path: Cadence high-speed circuit board design and practice. including schematic entry and components of data integration environment. the use of PCB design tools. as well as the late circuit design treatment need to master the skills. Growth path Electronics Engineers: Cadence high-speed circuit board design and practice content concise. fit in the PCB design work early and intermediate readers. as colleges and universities related professional teaching books. Contents: Chapter Cadence Allegro SPB 16.5 Introduction 1.1 Overview 1.2 Features 1.3 design flow 1.4 Cadence Allegro SPB 16.5 new features introduced in Chapter 2 Capture schematic design work platform 2.1 Design Entry CIS software features 2.2 the schematic working environment 2.3 Set Drawing Chapter 3 of the parameter 2.4 set print properties directly create individual components 3.1.1 New components 3.1.2 new spreadsheet components making components and creating components library 3.1 3.2 to create a composite package components 3.3 components split 3.4 created the 4.1 schematic design to create a new design specification 4.2 Capture basic terminology 4.3 4.4 component placement 4.4.1 placed on components of the basic components 4.4.2 Basic operation to create a new project in Chapter 4 of the other components Exercises 4.4.3 placed power 4.4.4 completed components placed 4.5 to create a classification module 4.6 modify components serial number and component values ??4.7 connection circuit diagram 4.8 title bar handle 4.9 add text and images Exercises Chapter 5 PCB design pretreatment 5.1 editing components and ground symbols The the signal attributes assigned attributes 5.2 Capture to Allegro PCB Editor 5.3 to establish differential application of 5.4 Capture in bus (Bus) 5.5 schematic drawing subsequent processing 5.5.1 design rule checking 5.5.2 components automatically numbered 5.5.3 reinjection ( Back Annotation) 5.5.4 automatically update the properties of the components or network 5.5.5 5.5.6 generate parts lists and cross-reference Table 5.5.7 Properties input and output parameters Exercises Chapter 6 Allegro attributes set 6.1 Allegro generate network table interface 6.2 customize Allegro Exercises Chapter 7 pad set Toolbar 6.3 produced 7.1 Concepts 7.2 hot air pads production 7.3 vias pad produced 7.4 patch pad making Chapter 8 components package making 8.1 making discrete components package the package symbol type 8.2 IC packaging (IC) production of 8.3 connector (IO) package produced 8.4 discrete components (DISCRETE) package produced 8.4.1 patch 8.4.2 DIP production of discrete components package 8.4.3 9.1 Creating self-defined pad package making exercises Chapter 9 PCB establish PCB9.2 import a netlist Exercises Chapter 10 Chapter 12 Chapter 11 layout set design rules copper clad (Shape) Chapter 14 of the post-processing of the 13 chapters wiringFour Satisfaction guaranteed,or money back.

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Bibliographic Details

• Title: Electronics Engineers growth path: Cadence high-speed circuit board design and practice(Chinese Edition)
• ISBN 10: 7121152517
• ISBN 13: 9787121152511
• Binding: paperback
• Condition: New

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Synopsis

《电子工程师成长之路：Cadence高速电路板设计与实践》以CadenceAHegroSPB16.5为基础，从设计实践的角度出发，以具体电路为范例，以PCB设计正常设计流程为顺序，由浅入深地讲解了元器件建库、原理图设计、布局、布线、规则设置、后处理等PCB设计的全过程。《电子工程师成长之路：Cadence高速电路板设计与实践》内容包括原理图输入及元器件数据集成管理环境的使用，PCB设计工具的使用，以及后期电路设计处理需要掌握的各项技能等。《电子工程师成长之路：Cadence高速电路板设计与实践》内容简明扼要，适合从事PCB设计工作的初、中级读者阅读，也可作为高等学校相关专业的教学用书。第1章CadenceAllegroSPB16.5简介1.1概述1.2功能特点1.3设计流程1.4CadenceAllegroSPB16.5新功能介绍第2章Capture原理图设计工作平台2.1DesignEntryCIS软件功能介绍2.2原理图工作环境2.3设置图纸参数2.4设置打印属性第3章制作元器件及创建元器件库3.1创建单个元器件3.1.1直接新建元器件3.1.2用电子表格新建元器件3.2创建复合封装元器件3.3大元器件的分割3.4创建其他元器件习题第4章创建新设计4.1原理图设计规范4.2Capture基本名词术语4.3建立新项目4.4放置元器件4.4.1放置基本元器件4.4.2对元器件的基本操作4.4.3放置电源和接地符号4.4.4完成元器件放置4.5创建分级模块4.6修改元器件序号与元器件值4.7连接电路图4.8标题栏的处理4.9添加文本和图像习题第5章PCB设计预处理5.1编辑元器件的属性5.2Capture到AllegroPCBEditor的信号属性分配5.3建立差分对5.4Capture中总线（Bus）的应用5.5原理图绘制后续处理5.5.1设计规则检查5.5.2为元器件自动编号5.5.3回注（BackAnnotation）5.5.4自动更新元器件或网络的属性5.5.5生成网络表5.5.6生成元器件清单和交互参考表5.5.7属性参数的输出/输入习题第6章Allegro的属性设置6.1Allegro的界面介绍6.2设置工具栏6.3定制Allegro环境习题第7章焊盘制作7.1基本概念7.2热风焊盘的制作7.3导通孔焊盘的制作7.4贴片焊盘的制作第8章元器件封装的制作8.1封装符号基本类型8.2集成电路封装（IC）的制作8.3连接器（IO）封装的制作8.4分立元器件（DISCRETE）封装的制作8.4.1贴片的分立元器件封装的制作8.4.2直插的分立元器件封装的制作8.4.3自定义焊盘封装制作习题第9章PCB的建立9.1建立PCB9.2导入网络表习题第10章设置设计规则第11章布局第12章覆铜（Shape）第13章布线第14章后处理