Electronic Packaging Materials and Their Properties. This item is unavailable.
Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul
Language: English
Published by CRC Press, 1998
- Hardcover
- New
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New
£ 243.71
Item description from seller
In English.
Seller Inventory # ria9780849396250_new
- Title
- Electronic Packaging Materials and Their Properties
- Author
- Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul
- Publisher
- CRC Press
- Publication year
- 1998
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0849396255
- ISBN 13
- 9780849396250
- Item weight
- 474 grams
- Series
- Book 3 of 4: Electronic Packaging
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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