Dependable Embedded Systems
Language: English
Published by Springer, 2020
- Hardcover
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Seller: Buchpark, Trebbin, GermanyBuchpark
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Add to basketItem description from seller
Zustand: Hervorragend | Seiten: 624 | Sprache: Englisch | Produktart: Bücher | This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today¿s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc.Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems;Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers;Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.…
Seller Inventory # 37060686/1
- Title
- Dependable Embedded Systems
- Author
- Unbekannt
- Publisher
- Springer
- Publication year
- 2020
- Condition
- Hervorragend
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 3030520161
- ISBN 13
- 9783030520168
- Seller catalogs
- Bücher
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc.
- Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems;
- Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers;
- Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
"Synopsis" may belong to another edition of this title.
About the Author
In recent years, Prof. Henkel has given more than ten keynotes at various international conferences primarily with focus on embedded systems dependability. He has given full/half-day tutorials at leading conferences like DAC, ICCAD, DATE etc. Prof. Henkel received the 2008 DATE Best Paper Award, the 2009 IEEE/ACM William J. Mc Calla ICCAD Best Paper Award, the Codes+ISSS 2015, 2014, and 2011 Best Paper Awards, and the MaXentric Technologies AHS 2011 Best Paper Award as well as the DATE 2013 Best IP Award and the DAC 2014 Designer Track Best Poster Award. He is the Chairman of the IEEE Computer Society, Germany Section, and was the Editor-in-Chief of the ACM Transactions on Embedded Computing Systems (ACM TECS) for two consecutive terms. He is an initiator and the coordinator of the German Research Foundation's (DFG) program on 'Dependable Embedded Systems' (SPP 1500). He is the site coordinator (Karlsruhe site) of the Three-University Collaborative Research Center on "Invasive Computing" (DFG TR89). He is the Editor-in-Chief of the IEEE Design&Test Magazine. He holds ten US patents and is a Fellow of the IEEE.
"About the title" may belong to another edition of this title.
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