Carbon Nanotube Based VLSI Interconnects

Manoj Kumar Majumder

ISBN 10: 8132220463 / ISBN 13: 9788132220466

Published by Springer India, Springer India Nov 2014, 2014

About this Item

Neuware -The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 100 pp. Englisch.

Seller Inventory # 9788132220466

Bibliographic Details

• Title: Carbon Nanotube Based VLSI Interconnects
• Publisher: Springer India, Springer India Nov 2014
• Publication Date: 2014
• Language: English
• ISBN 10: 8132220463
• ISBN 13: 9788132220466
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 6D millimeters 235 millimeters width by 155 millimeters height by 6 millimeters depth
• Weight: 166 grams

About this title

Synopsis

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

About the Author

Brajesh Kumar Kaushik is currently working as Associate Professor in Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, India. Dr. Kaushik has completed his PhD from Indian Institute of Technology Roorkee in 2007. His research interests include Signal Integrity, Propagation Delay, and Power Dissipation of VLSI Interconnects; Low Power VLSI Design; Electronic Design Automation (EDA)-Circuit and Systems-CAD. Dr. Kaushik has authored more than 60 papers in peer reviewed international journals and over 80 papers in international Conferences. He has also authored many book chapters, which includes 3 chapters in Springer books. Dr. Kaushik is also an Editor-in-Chief of VLSI Design & Communication System (VLSICS) and Editor of Journal of Electrical and Electronics Engineering Research (JEEER), Academic Journals and Journal of Engineering, Design and Technology (JEDT), Emerald.

Manoj Kumar Majumder, Research Scholar, is currently pursuing his PhD from Indian Institute of Technology, Roorkee, India. Prior to this, he completed his BTech from Dr. B. C. Roy Engineering College, Durgapur in 2007 and M.Tech from Bengal Engineering and Science University, Shibpur in 2009. He has also worked as lecturer in Department of Electronics and Communication Engineering at Durgapur Institute of Advanced Technology and Management (DIATM), West Bengal. He has one book chapter and several journal and conference publications to his credit.