Bonding in Microsystem Technology
Language: English
Published by Springer Netherlands, Springer Netherlands Nov 2010, 2010
Series: Book 10 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- New
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
AbeBooks seller since January 23, 2017
Condition: New
£ 139.15
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Add to basketItem description from seller
This item is printed on demand - Print on Demand Titel. Neuware -Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author¿s personal experience.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 352 pp. Englisch.…
Seller Inventory # 9789048171514
- Title
- Bonding in Microsystem Technology
- Author
- Jan A. Dziuban
- Publisher
- Springer Netherlands, Springer Netherlands Nov 2010
- Publication year
- 2010
- Condition
- Neu
- Binding
- Taschenbuch
- Language
- English
- ISBN 10
- 9048171512
- ISBN 13
- 9789048171514
- Item weight
- 534 grams
- Dimensions
- 235x155x20 mm
- Series
- Book 10 of 72: Springer Series in Advanced Microelectronics
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
"Synopsis" may belong to another edition of this title.
Review
From the reviews:
"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)
"About the title" may belong to another edition of this title.
buchversandmimpf2000
Emtmannsberg, BAYE, Germany
AbeBooks seller since January 23, 2017
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