Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Language: English

Published by Springer US, 2000

0792372786 / 9780792372783

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Druck auf Anfrage Neuware - Printed after ordering - Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.…

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Title
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Author
G. Q. Zhang
Publisher
Springer US
Publication year
2000
Condition
Neu
Binding
Buch
Language
English
ISBN 10
0792372786
ISBN 13
9780792372783
Item weight
431 grams
Dimensions
241x160x16 mm

AHA-BUCH GmbH

Einbeck, Germany

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