Area Array Interconnection Handbook (Paperback)
Language: English
Published by Springer-Verlag New York Inc., New York, NY, 2012
- Softcover
- New
Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
AbeBooks seller since June 22, 2007
Condition: New
£ 76.29
Quantity: 1 available
Add to basketItem description from seller
Paperback. Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…
Seller Inventory # 9781461355298
- Title
- Area Array Interconnection Handbook (Paperback)
- Author
- Karl J. Puttlitz
- Publisher
- Springer-Verlag New York Inc., New York, NY
- Publication year
- 2012
- Condition
- new
- Binding
- Paperback
- Language
- English
- ISBN 10
- 146135529X
- ISBN 13
- 9781461355298
"Synopsis" may belong to another edition of this title.
AussieBookSeller
Truganina, VIC, Australia
AbeBooks seller since June 22, 2007
Shipping rates from Australia to U.S.A.
| Item | 25 to 45 business days | 8 to 14 business days |
|---|---|---|
| First item | £ 27.68 | £ 32.91 |
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The Nile Group Pty Ltd
42 Apex Drive
Truganina, VIC Australia 3029
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