Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Book 50 of 74: Springer Series in Advanced Manufacturing

Seok, Seonho

ISBN 10: 3030085619 ISBN 13: 9783030085612
Published by Springer Nature, 2019
Language: English
Condition: New Soft cover

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New - Soft cover

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