Advanced Materials for Thermal Management of Electronic Packaging

Xingcun Colin Tong

ISBN 10: 1461427924 ISBN 13: 9781461427926
Published by Springer New York, Springer US Feb 2013, 2013
Language: English
Condition: New Soft cover

Sold by buchversandmimpf2000, Emtmannsberg, BAYE, Germany

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New - Soft cover

Condition: New

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