Advanced Flip Chip Packaging

Language: English

Published by Springer US, 2016

1489979336 / 9781489979339

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Seller: moluna, Greven, Germanymoluna

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear.

Seller Inventory # 458511201

Title
Advanced Flip Chip Packaging
Author
Tong, Ho-Ming|Lai, Yi-Shao|Wong, C. P.
Publisher
Springer US
Publication year
2016
Condition
New
Binding
Soft cover
Language
English
ISBN 10
1489979336
ISBN 13
9781489979339

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
First item£ 42.11£ 42.11
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Moluna GmbH

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Greven, Germany 48268