Adhesion in Microelectronics
Language: English
Published by John Wiley and Sons Inc, US, 2014
- Hardcover
- New
Seller: Rarewaves.com USA, London, London, United KingdomRarewaves.com USA
AbeBooks seller since June 11, 2025
Condition: New
£ 229.69
Quantity: 1 available
Add to basketItem description from seller
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings.
Seller Inventory # LU-9781118831335
- Title
- Adhesion in Microelectronics
- Author
- K. L. Mittal, Tanweer Ahsan
- Publisher
- John Wiley and Sons Inc, US
- Publication year
- 2014
- Condition
- New
- Binding
- Hardback
- Language
- English
- ISBN 10
- 1118831330
- ISBN 13
- 9781118831335
- Item weight
- 635 grams
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of materials as it pertains to adhesion
- Surface cleaning as it pertains to adhesion
- Ways to improve adhesion
- Unraveling of interfacial interactions using an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to various substrates
- Adhesion of thin films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of different dielectric materials
- Delamination and reliability issues in packaged devices
- Interface mechanics and crack propagation
- Adhesion measurement of thin films and coatings
"Synopsis" may belong to another edition of this title.
About the Author
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Sk?odowska University, Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
Tanweer Ahsan is a scientist engineer at Henkel Electronic Materials LLC in Irvine, California.
"About the title" may belong to another edition of this title.
Rarewaves.com USA
London, London, United Kingdom
AbeBooks seller since June 11, 2025
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