Synopsis
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
"synopsis" may belong to another edition of this title.
From the Back Cover
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
"About this title" may belong to another edition of this title.
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Reliability Technology for Integrated Circuit Packaging
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Reliability Technology for Integrated Circuit Packaging
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Springer-Verlag Gmbh Apr 2026, 2026
ISBN 10: 981953884X
ISBN 13: 9789819538843
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of 'high-quality development' a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. 510 pp. Englisch. Seller Inventory # 9789819538843
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Reliability Technology for Integrated Circuit Packaging (Hardcover)
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Springer Verlag, Singapore, Singapore, 2026
ISBN 10: 981953884X
ISBN 13: 9789819538843
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Hardcover. Condition: new. Hardcover. This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9789819538843
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Reliability Technology for Integrated Circuit Packaging
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Buch. Condition: Neu. Reliability Technology for Integrated Circuit Packaging | Bin Zhou (u. a.) | Buch | xxviii | Englisch | 2026 | Springer | EAN 9789819538843 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Seller Inventory # 135369206
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Reliability Technology for Integrated Circuit Packaging
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Springer, Springer Apr 2026, 2026
ISBN 10: 981953884X
ISBN 13: 9789819538843
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 540 pp. Englisch. Seller Inventory # 9789819538843
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Reliability Technology for Integrated Circuit Packaging
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of 'high-quality development' a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry. Seller Inventory # 9789819538843
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Reliability Technology for Integrated Circuit Packaging
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Reliability Technology for Integrated Circuit Packaging
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