Reliability Technology for Integrated Circuit Packaging - Hardcover

Zhou, Bin; En, Yunfei; Chen, Si

 
9789819538843: Reliability Technology for Integrated Circuit Packaging
Hardcover
ISBN 10: 981953884X ISBN 13: 9789819538843
Publisher: Springer, 2026

Synopsis

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

"synopsis" may belong to another edition of this title.

From the Back Cover

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

"About this title" may belong to another edition of this title.

Publisher
Springer
Publication date
2026
Language
English
ISBN 10 
981953884X
ISBN 13 
9789819538843
Binding
Hardcover
Number of pages
538