Advances In 3D Integrated Circuits And Systems: 1 (Series on Emerging Technologies in Circuits and Systems) - Hardcover

Yu Hao & Tan Chuan Seng

Hardcover

ISBN 10: 9814699004 ISBN 13: 9789814699006

Publisher: World Scientific Publishing Company, 2015

Synopsis

 

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.

Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

About this title

From the Back Cover

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Edition details

• Publisher: World Scientific Publishing Company
• Publication date: 2015
• Language: English
• ISBN 10: 9814699004
• ISBN 13: 9789814699006
• Binding: Hardcover
• Number of pages: 392