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DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS: 2 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING) - Hardcover

Book 2 of 7: WSPC Series in Advanced Integration and Packaging

SWAMINATHAN MADHAVAN ET AL

 
9789814508599: DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS: 2 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)
Hardcover
ISBN 10: 9814508594 ISBN 13: 9789814508599
Publisher: World Scientific Publishing Company, 2014

Synopsis

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

"synopsis" may belong to another edition of this title.

From the Back Cover

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

"About this title" may belong to another edition of this title.

Publisher
World Scientific Publishing Company
Publication date
2014
Language
English
ISBN 10 
9814508594
ISBN 13 
9789814508599
Binding
Hardcover
Number of pages
380