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Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series) - Hardcover

 
9789811931314: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series)

Synopsis

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

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About the Author

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.

Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

From the Back Cover

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

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  • PublisherSpringer
  • Publication date2022
  • ISBN 10 9811931313
  • ISBN 13 9789811931314
  • BindingHardcover
  • LanguageEnglish
  • Edition number1
  • Number of pages188

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9789811931345: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series)

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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimenta. Seller Inventory # 584145631

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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 188 pp. Englisch. Seller Inventory # 9789811931314

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Buch. Condition: Neu. Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch. Seller Inventory # 9789811931314

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Hardcover. Condition: new. Hardcover. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9789811931314

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