Microelectronic Interconnections and Assembly: 54 (NATO Science Partnership Subseries: 3, 54) - Softcover
Synopsis
The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with.
The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported.
Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.
"synopsis" may belong to another edition of this title.
Other Popular Editions of the Same Title
Search results for Microelectronic Interconnections and Assembly: 54 (NATO...
Stock Image
Microelectronic Interconnections and Assembly (eng)
Print on DemandSeller: Brook Bookstore On Demand, Napoli, NA, Italy
Seller rating 3 out of 5 stars
Condition: new. Questo è un articolo print on demand. Seller Inventory # EGXQQE1ULD
Buy New
£ 41.14
£ 5.88 shipping
Ships from Italy to U.S.A.
Ships from Italy to U.S.A.
Quantity: Over 20 available
Seller Image
Microelectronic Interconnections and Assembly
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: New. Seller Inventory # 20348335-n
Seller Image
Microelectronic Interconnections and Assembly
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition. Seller Inventory # 20348335
Stock Image
Microelectronic Interconnections and Assembly (NATO Science Partnership Subseries: 3, 54)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In. Seller Inventory # ria9789401061599_new
Buy New
£ 50.80
£ 11.98 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Seller Image
Microelectronic Interconnections and Assembly
Published by
Springer Netherlands Nov 2012, 2012
ISBN 10: 9401061599
ISBN 13: 9789401061599
New
Taschenbuch
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages. 316 pp. Englisch. Seller Inventory # 9789401061599
Stock Image
Microelectronic Interconnections and Assembly
Seller: Books Puddle, New York, NY, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. pp. 316. Seller Inventory # 26126777671
Stock Image
Microelectronic Interconnections and Assembly
Print on DemandSeller: Majestic Books, Hounslow, United Kingdom
Seller rating 4 out of 5 stars
Condition: New. Print on Demand pp. 316 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam. Seller Inventory # 133809816
Buy New
£ 66.36
£ 6.50 shipping
Ships from United Kingdom to U.S.A.
Ships from United Kingdom to U.S.A.
Quantity: 4 available
Stock Image
Microelectronic Interconnections and Assembly
Print on DemandSeller: Biblios, Frankfurt am main, HESSE, Germany
Seller rating 4 out of 5 stars
Condition: New. PRINT ON DEMAND pp. 316. Seller Inventory # 18126777677
Seller Image
Microelectronic Interconnections and Assembly
Print on DemandSeller: moluna, Greven, Germany
Seller rating 5 out of 5 stars
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996 MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel M. Seller Inventory # 5832790
Buy New
£ 43.05
£ 42.33 shipping
Ships from Germany to U.S.A.
Ships from Germany to U.S.A.
Quantity: Over 20 available
Seller Image
Microelectronic Interconnections and Assembly
Published by
Springer, Springer Nov 2012, 2012
ISBN 10: 9401061599
ISBN 13: 9789401061599
New
Taschenbuch
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 316 pp. Englisch. Seller Inventory # 9789401061599