Electronic Packaging for High Reliability, Low Cost Electronics: 57 (NATO Science Partnership Subseries: 3, 57) - Softcover
Synopsis
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Electronic Packaging for High Reliability, Low Cost Electronics (eng)
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Electronic Packaging for High Reliability, Low Cost Electronics
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 308 pp. Englisch. Seller Inventory # 9789048150854
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Electronic Packaging for High Reliability, Low Cost Electronics
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within. Seller Inventory # 5818945
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Electronic Packaging for High Reliability, Low Cost Electronics
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Taschenbuch. Condition: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer | EAN 9789048150854 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Seller Inventory # 107181646
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Electronic Packaging for High Reliability, Low Cost Electronics
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Electronic Packaging for High Reliability, Low Cost Electronics
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Springer Netherlands, Springer Dez 2010, 2010
ISBN 10: 904815085X
ISBN 13: 9789048150854
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch. Seller Inventory # 9789048150854
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Electronic Packaging for High Reliability, Low Cost Electronics
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Electronic Packaging for High Reliability, Low Cost Electronics
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ISBN 10: 904815085X
ISBN 13: 9789048150854
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. Seller Inventory # 9789048150854
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Electronic Packaging for High Reliability, Low Cost Electronics (Nato Science Partnership Sub-Series: 3)
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Electronic Packaging for High Reliability, Low Cost Electronics
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Condition: New. PRINT ON DEMAND pp. 328. Seller Inventory # 182582233