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TMS320C55x DSP Application Design (3rd Edition) five universities planning materials(Chinese Edition) - Softcover
Synopsis
Paperback. Pub Date :2014-03-01 Pages: 403 Language: Chinese Publisher: Beijing University of Aeronautics and Astronautics Press TMS320C55x DSP Application Design (3rd Edition) five universities planning materials. TI's TMS320C55x series chips as an object. a systematic introduction to the basics of design methods developed DSP chip and DSP applications. The book is divided into 10 chapters. the main contents are: C55x hardware architecture and instruction; using assembly language. CC + + language basics and C55x software development methods. including the use of methods including CCS5.4 software development tools; typical applications program design. including data scaling and overflow handling. multi-word integer. decimal addition. subtraction. multiplication and division. FIR. IIR filters. FFT. using DSPLIB library. etc.; peripherals and CSL library on common C55x tablets...
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TMS320C55x DSP Application Design (3rd Edition) five universities planning materials(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
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paperback. Condition: New. Paperback. Pub Date :2014-03-01 Pages: 403 Language: Chinese Publisher: Beijing University of Aeronautics and Astronautics Press TMS320C55x DSP Application Design (3rd Edition) five universities planning materials. TI's TMS320C55x series chips as an object. a systematic introduction to the basics of design methods developed DSP chip and DSP applications. The book is divided into 10 chapters. the main contents are: C55x hardware architecture and instruction; using assembly language. CC + + lan. Seller Inventory # BX067383