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DSP chip technology application development in the 21st century universities planning materials and electronic information(Chinese Edition) - Softcover

YAN DI QUN , WANG XIAO DONG , ZHOU YA XUN

 
9787302326311: DSP chip technology application development in the 21st century universities planning materials and electronic information(Chinese Edition)

Synopsis

Language:Chinese.SoftCover.Pub Date:2014-01-01.publisher:Tsinghua University Press.description:Paperback. Pub Date :2014-01-01 Pages: 200 Language: Chinese Publisher: Tsinghua University Press DSP chip technology application development in the 21st century universities planning materials and electronic information. according to the undergrad

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