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Modeling. Analysis. Design and Tests for Electronics Packaging beyond Moore(Chinese Edition) - Hardcover
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Language:English.HardCover.Pub Date:2021-03-01.publisher:Chemical Industry Press.description:HardCover.Pub Date:2021-03-01 Pages:420 Language:English Publisher:Chemical Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content in
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Modeling. Analysis. Design and Tests for Electronics Packaging beyond Moore(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. HardCover.Pub Date:2021-03-01 Pages:420 Language:English Publisher:Chemical Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content involves the electrical properties. thermal properties. thermomechanical properties. heat dissipation issues. reliability issues. electrical crosstalk of 2.5D. 3D. wafer-level packaging. etc. A modeling method based on the volume average theory of p. Seller Inventory # NX046096