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IC chip packaging technology ( 2nd Edition ) application personnel training colleges planning materials(Chinese Edition) - Softcover
Synopsis
Paperback. Pub Date :2013-07-01 Pages: 252 Language: Chinese Publisher: Electronic Industry Press IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials is a general-purpose integrated circuits chip packaging technology materials. The book has 13 chapters. including integrated circuit chip package overview. packaging process. thick film technology . welding materials. printed circuit boards. components and circuit board bonding . sealing plastic materials and technology . ceramic packaging . plastic packaging . hermetic encapsulation . package reliability engineering. packaging process defect analysis and advanced packaging technologies. IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials in the system on a seek reasonable and complete . in terms of content and strive to close the packaging indust...
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IC chip packaging technology ( 2nd Edition ) application personnel training colleges planning materials(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-07-01 Pages: 252 Language: Chinese Publisher: Electronic Industry Press IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials is a general-purpose integrated circuits chip packaging technology materials. The book has 13 chapters. including integrated circuit chip package overview. packaging process. thick film technology . welding materials. printed circuit boards. components and circuit board bonding . sealing plastic materials.Four Satisfaction guaranteed,or money back. Seller Inventory # BR077070