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Language:Chinese.Soft cover.publisher:Electronics Industry Publishing House Pub. Date :2.description:Paperback. Publisher: Electronic Industry Publishing House Pub. Date :2010-07-01. Cold stamping Difficulties and mold design techniques. Chapter 7. Chapter 1 describes the stamping die design difficulties and skills; Chapter 2 describes the bending d
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cold stamping die design challenges and techniques(Chinese Edition)
Published by
Electronics Industry Publishing House Pub. Date :2, 2010
ISBN 10: 7121111764
ISBN 13: 9787121111761
New
paperback
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Language:Chinese.Paperback. Publisher: Electronic Industry Publishing House Pub. Date :2010-07-01. Cold stamping Difficulties and mold design techniques. Chapter 7. Chapter 1 describes the stamping die design difficulties and skills; Chapter 2 describes the bending die design challenges and techniques; Chapter 3 describes the difficulty of drawing die design and techniques; Chapter 4 Die design challenges and techniques; Chapter 5 Cold extrusion die design challenges and techniques; Chapter 6. Seller Inventory # H36421