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Language:Chinese.Soft cover.publisher:Electronic Industry Press.description:Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive
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Multichip module technology handbook(Chinese Edition)
Published by
Electronic Industry Press, 1991
ISBN 10: 712102280X
ISBN 13: 9787121022807
New
paperback
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Language:Chinese.Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive. Seller Inventory # D19252