Language:Chinese.Soft cover.publisher:Electronic Industry Press.description:Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive
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paperback. Condition: New. Language:Chinese.Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive. Seller Inventory # D19252
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