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Language:Chinese.HardCover.Pub Date:2022-06-01.publisher:Machinery Industry Press.description:HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development con
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Microelectronics Wire Bonding (Original Book 3rd Edition)(Chinese Edition)
Published by
Machinery Industry Press, 2022
ISBN 10: 711169709X
ISBN 13: 9787111697091
New
Hardcover
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. Language:Chinese.HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development context and latest achievements of wire bonding technology in the past 70 years. and makes an outlook on the future development trend. The main contents include: ultrasonic bonding system and technology. metallurgical characteristics. Seller Inventory # NX045985
Stock Image
Microelectronics Wire Bonding (Original Book 3rd Edition)(Chinese Edition)
Published by
Machinery Industry Press, 2022
ISBN 10: 711169709X
ISBN 13: 9787111697091
New
Hardcover
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. Language:Chinese.HardCover.Pub Date:2022-06-01 Publisher:Machinery Industry Press Microelectronics Wire Bonding (3rd Edition) translated from Professor George Harman's book Wire Bonding in Microelectronics (3rd Edition) . systematically summarizes the development context and latest achievements of wire bonding technology in the past 70 years. and makes an outlook on the future development trend. The main contents include: ultrasonic bonding system and technology. metallurgical characteristics. Seller Inventory # AMZ065386_NX045985_065386