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Integrated circuit advanced packaging technology - Cu-Cu bonding technology(Chinese Edition) - Hardcover
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Language:Chinese.HardCover.Pub Date:2022-03-01.publisher:Higher Education Press.description:HardCover.Pub Date:2022-03-01 Pages:187 Language:Chinese Publisher:Higher Education Press Interconnect bonding in microelectronic packaging is a key and difficult link in the back-end manufacturing of integrated circuits (ICs). . which directly affec
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Integrated circuit advanced packaging technology - Cu-Cu bonding technology(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
Hardcover. Condition: New. HardCover.Pub Date:2022-03-01 Pages:187 Language:Chinese Publisher:Higher Education Press Interconnect bonding in microelectronic packaging is a key and difficult link in the back-end manufacturing of integrated circuits (ICs). . which directly affects the physical properties of the integrated circuit itself. such as electrical properties. optical properties and thermal properties. and largely determines the miniaturization. functionalization. reliability and production cost of IC products. H. Seller Inventory # NX045767