Seller: liu xing, Nanjing, JS, China
paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Pages Number: 306 Publisher: Higher Education Pub. Date :2010-05-01 version 2. This book is a general higher education. Eleventh Five-Year national planning materials. a total of 13 book chapters. details the major components of the microcomputer (such as CPU. motherboard. memory. graphics card. hard drive. optical drive. removable storage devices. network connections. etc.) of new products. new technologies. new features. and the selection. installation. use and maintenance of such knowledge. with the latest. most popular microcomputers. for example. detail about the new microcomputer assembly process. system settings and the latest version of the software to use common tools. common faults of handling the problem. The last part of the book is practical training content. gives the understanding of microcomputer systems from basic components. assembly. use of common tools to deal with common system failures. 14 maintenance training. Book is easy to understand. illustrated. focusing on practical application. The book mainly deals with the latest hardware technology and the most commonly used software. suitable for vocational. vocational and technical colleges. computer training materials can also be assembled as a microprocessor. a practical manual for maintenance personnel and the general microcomputer DIY enthusiasts of self-reference. This book can support electronic teaching in higher education. Higher Polytechnic Press. teaching resources network download at http:www.hep-st.com.cn. Contents: Chapter 1 Microcomputer System Overview 1.1 micro computer microcomputer system development 1.2 1.3 microcomputer system. the basic components of the hardware configuration of microcomputer resource management 1.4 General principles Exercise 1 Overview Chapter 2 CPU2.1 basic 2.1.1CPU composition 2.1.2CPU development 2.1.3CPU performance indicators 2.1.4CPU the new technology package 2.2CPU Introduction 2.3 Introduction 2.4CPU mainstream CPU performance tests 2.5CPU Selection and Installation Exercise 2 Chapter 3 board structure and composition of the board 3.1 3.1.1 Structure of the motherboard components 3.1.3 3.1.2 motherboard motherboard motherboard chipset parameters of 3.2. the interface bus and the motherboard chipset 3.2.1 3.2.2 3.2.3 bus motherboard motherboard motherboard used 3.3 interface and mainstream motherboard motherboard used 3.3.2 Introduction 3.3.1 Introduction to the mainstream motherboard motherboard troubleshooting exercises 3.4 3 4.1 Chapter 4 memory read-only memory memory type 4.1.1 4.2 4.1.2 RAM memory performance and specification 4.2 4.2.2 .1 memory performance memory and memory specifications 4.3 4.3.1 memory packaging technology development of the technological development of packaging technology for the development of memory 4.3.2 4.4 4.4.1 Memory installed memory with optional memory to install 4.4.2 4.5 Selection of common memory fault handling Chapter 5 Problem 4 5.1 graphics card and display graphics architecture 5.1.1 5.1.2 5.1.3 5.1.4 graphics card works the main key performance indicators 5.1.5 new graphics card technology 5.1.6 5.1.7 graphics card installation and set up the selection of 5.2 Display 5.2.1 Overview . . Chapter 6. Chapter 7. an external storage device chassis. power supply. keyboard and mouse. multimedia components used in Chapter 8 and the first network connection components Chapter 9 Chapter 10 microcomputer printer assembly of Chapter 11 system maintenance tools commonly used in Chapter 12 microcomputer system maintenance and repair Chapter 13 microcomputer assembly and maintenance of experimental referencesFour Satisfaction guaranteed,or money back. Seller Inventory # LJ0811