Synopsis
Paperback. Pub Date :2014-01-01 Pages: 487 Language: Chinese Publisher: Science Press Information Science and Technology Academic Works Series: silicon vias for 3D integration technology to discuss the three-dimensional integrated silicon systems used in electronics. optoelectronics and MEMS devices latest progress through hole (TSV) technology and the possible future evolution trend. while a three-dimensional integrated detailed discussion of the major technological problems that exist in key technologies and possible solutions. Origin introduced by the semiconductor industry in nanotechnology and 3D integration technology and the evolution of history. combined with the development of three-dimensional integrated key focus of the current discussion of TSV technology process technology. wafer thinning and thin-wafer assembly process to get in the package held technology. thr...
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Through-Silicon Vias for 3D Integration(Chinese Edition)
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Paperback. Pub Date :2014-01-01 Pages: 487 Language: Chinese Publisher: Science Press Information Science and Technology Academic Works Series: silicon vias for 3D integration technology to discuss the three-dimensional integrated silicon systems used in electronics. optoelectronics and MEMS devices latest progress through hole (TSV) technology and the possible future evolution trend. while a three-dimensional integrated detailed discussion of the major technological problems that exist in ke. Seller Inventory # BX067803