Cuprous is key to acceleration in Copper bottom up filling - Softcover

Kondo, Kazuo

Softcover

ISBN 10: 620200634X ISBN 13: 9786202006347

Publisher: LAP LAMBERT Academic Publishing, 2017

Synopsis

Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1μm, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help.

About this title

About the Author

Kazuo Kondo is Professor and Director of Small Feature Electrodeposition Center, Osaka Prefecture University. He has worked for Sumitomo Metal Industries, Hokkaido University and Okayama University. He has 200 research publications and 100 patents. His research is Copper Electrodeposition for wiring of semiconductor and electronics packaging.

Edition details

• Publisher: LAP LAMBERT Academic Publishing
• Publication date: 2017
• Language: English
• ISBN 10: 620200634X
• ISBN 13: 9786202006347
• Binding: Paperback
• Number of pages: 84