The progression in very large scale integration, billions of transistors and components can be placed on a single semiconductor chip for implementation of complex circuitry. The growth in recent technology is towards miniaturization of semiconductor devices, which have several noticeable hindrances in heat dissipation, power utility, chip area and efficiency of the devices. As the technology advances more into deep submicron level, feature sizes, power dissipation due to leakage current are increasing at an alarming rate. Numerous projections show that leakage power will develop into analogous to dynamic power dissipation in coming years; however dynamic power is also increasing and still dominates. The optimal solution for solving these hindrances is to analyze the performance of VLSI circuit designed using different CMOS technologies.
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The progression in very large scale integration, billions of transistors and components can be placed on a single semiconductor chip for implementation of complex circuitry. The growth in recent technology is towards miniaturization of semiconductor devices, which have several noticeable hindrances in heat dissipation, power utility, chip area and efficiency of the devices. As the technology advances more into deep submicron level, feature sizes, power dissipation due to leakage current are increasing at an alarming rate. Numerous projections show that leakage power will develop into analogous to dynamic power dissipation in coming years; however dynamic power is also increasing and still dominates. The optimal solution for solving these hindrances is to analyze the performance of VLSI circuit designed using different CMOS technologies. 176 pp. Englisch. Seller Inventory # 9786139994441
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Thangarajan SheelaDr.T.SHEELA obtained her Doctorate degree in VLSI Design in 2015 from Vinayaka Missions Research Foundation, Salem and Master degree from Anna University in 2008. She is an Associate Professor/ECE at VMKVEC, Salem. . Seller Inventory # 274023889
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Taschenbuch. Condition: Neu. Investigations On Performance Evaluation Of CMOS VLSI | Sheela Thangarajan (u. a.) | Taschenbuch | 176 S. | Englisch | 2019 | LAP LAMBERT Academic Publishing | EAN 9786139994441 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu. Seller Inventory # 115380398
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The progression in very large scale integration, billions of transistors and components can be placed on a single semiconductor chip for implementation of complex circuitry. The growth in recent technology is towards miniaturization of semiconductor devices, which have several noticeable hindrances in heat dissipation, power utility, chip area and efficiency of the devices. As the technology advances more into deep submicron level, feature sizes, power dissipation due to leakage current are increasing at an alarming rate. Numerous projections show that leakage power will develop into analogous to dynamic power dissipation in coming years; however dynamic power is also increasing and still dominates. The optimal solution for solving these hindrances is to analyze the performance of VLSI circuit designed using different CMOS technologies.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 176 pp. Englisch. Seller Inventory # 9786139994441
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The progression in very large scale integration, billions of transistors and components can be placed on a single semiconductor chip for implementation of complex circuitry. The growth in recent technology is towards miniaturization of semiconductor devices, which have several noticeable hindrances in heat dissipation, power utility, chip area and efficiency of the devices. As the technology advances more into deep submicron level, feature sizes, power dissipation due to leakage current are increasing at an alarming rate. Numerous projections show that leakage power will develop into analogous to dynamic power dissipation in coming years; however dynamic power is also increasing and still dominates. The optimal solution for solving these hindrances is to analyze the performance of VLSI circuit designed using different CMOS technologies. Seller Inventory # 9786139994441