This Reprint features nine peer-reviewed open-access articles from Electronics' special issue on the interdisciplinary synergy of artificial intelligence, computer vision, and 3D display technologies, curated by leading experts in holography, AI, 3D imaging and optical signal processing. It advances theoretical and practical applications across core domains including holographic display, 3D quality inspection, AI-driven imaging, and edge computer vision, bridging academia and industry with solutions to real-world technical challenges.
Highlighted research includes a noise-resilient edge-based masked face detection framework with 30% higher precision under severe Gaussian noise and improved throughput; a 3D mold manufacturing inspection system delivering 99% classification accuracy with minimal training data, outperforming deep learning models; and an end-to-end camera pose estimation method with 16% better pose and nearly 30% higher translation accuracy than conventional approaches.
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Hardcover. Condition: new. Hardcover. This Reprint features nine peer-reviewed open-access articles from Electronics' special issue on the interdisciplinary synergy of artificial intelligence, computer vision, and 3D display technologies, curated by leading experts in holography, AI, 3D imaging and optical signal processing. It advances theoretical and practical applications across core domains including holographic display, 3D quality inspection, AI-driven imaging, and edge computer vision, bridging academia and industry with solutions to real-world technical challenges.Highlighted research includes a noise-resilient edge-based masked face detection framework with 30% higher precision under severe Gaussian noise and improved throughput; a 3D mold manufacturing inspection system delivering 99% classification accuracy with minimal training data, outperforming deep learning models; and an end-to-end camera pose estimation method with 16% better pose and nearly 30% higher translation accuracy than conventional approaches. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9783725873043
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Hardcover. Condition: new. Hardcover. This Reprint features nine peer-reviewed open-access articles from Electronics' special issue on the interdisciplinary synergy of artificial intelligence, computer vision, and 3D display technologies, curated by leading experts in holography, AI, 3D imaging and optical signal processing. It advances theoretical and practical applications across core domains including holographic display, 3D quality inspection, AI-driven imaging, and edge computer vision, bridging academia and industry with solutions to real-world technical challenges.Highlighted research includes a noise-resilient edge-based masked face detection framework with 30% higher precision under severe Gaussian noise and improved throughput; a 3D mold manufacturing inspection system delivering 99% classification accuracy with minimal training data, outperforming deep learning models; and an end-to-end camera pose estimation method with 16% better pose and nearly 30% higher translation accuracy than conventional approaches. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. Seller Inventory # 9783725873043
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Hardcover. Condition: new. Hardcover. This Reprint features nine peer-reviewed open-access articles from Electronics' special issue on the interdisciplinary synergy of artificial intelligence, computer vision, and 3D display technologies, curated by leading experts in holography, AI, 3D imaging and optical signal processing. It advances theoretical and practical applications across core domains including holographic display, 3D quality inspection, AI-driven imaging, and edge computer vision, bridging academia and industry with solutions to real-world technical challenges.Highlighted research includes a noise-resilient edge-based masked face detection framework with 30% higher precision under severe Gaussian noise and improved throughput; a 3D mold manufacturing inspection system delivering 99% classification accuracy with minimal training data, outperforming deep learning models; and an end-to-end camera pose estimation method with 16% better pose and nearly 30% higher translation accuracy than conventional approaches. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. Seller Inventory # 9783725873043
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