This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
"synopsis" may belong to another edition of this title.
This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
"About this title" may belong to another edition of this title.
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Buch. Condition: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 18th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2010, held in Madrid, Spain, in September 2010. The 14 papers included in the book were carefully reviewed and selected from the 52 full papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 368 pp. Englisch. Seller Inventory # 9783642285653
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