Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Softcover

Seok, Seonho

 
9783319778730: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Softcover
ISBN 10: 3319778730 ISBN 13: 9783319778730
Publisher: Springer, 2018

This specific ISBN edition is currently not available.

Synopsis

Overview of MEMS packaging technologies.- Adhesion control techniques for debonding.- FEM modeling of debonding.- Polymer cap transfer packaging technologies.- Thin film cap transfer packaging technology.- Other related manufacturing technologies. 

"synopsis" may belong to another edition of this title.

Publisher
Springer
Publication date
2018
Language
English
ISBN 10 
3319778730
ISBN 13 
9783319778730
Binding
Paperback

Other Popular Editions of the Same Title

9783319778716: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using ... (Springer Series in Advanced Manufacturing)

Featured Edition

ISBN 10:  3319778714 ISBN 13:  9783319778716
Publisher: Springer, 2018
Hardcover