High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering) - Softcover

Book 45 of 209: SpringerBriefs in Electrical and Computer Engineering

Kim, Chulwoo; Lee, Hyun-Woo; Song, Junyoung

 
9783319023809: High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering)
Softcover
ISBN 10: 3319023802 ISBN 13: 9783319023809
Publisher: Springer, 2013

Synopsis

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

"synopsis" may belong to another edition of this title.

From the Back Cover

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

• Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design;
• Presents state-of-the-art techniques for memory interface design;
• Covers memory interface design at both the circuit level and system architecture level.

"About this title" may belong to another edition of this title.

Publisher
Springer
Publication date
2013
Language
English
ISBN 10 
3319023802
ISBN 13 
9783319023809
Binding
Paperback
Number of pages
96