Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs - Softcover

Noia, Brandon; Chakrabarty, Krishnendu

 
9783319023793: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Softcover
ISBN 10: 3319023799 ISBN 13: 9783319023793
Publisher: Springer, 2013

This specific ISBN edition is currently not available.

Synopsis

Introduction.- Wafer Stacking and 3D Memory Test.- Built-in Self-Test for TSVs.- Pre-Bond TSV Test Through TSV Probing.- Pre-Bond TSV Test Through TSV Probing.- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths.- Post-Bond Test Wrappers and Emerging Test Standards.- Test-Architecture Optimization and Test Scheduling.- Conclusions.

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Publisher
Springer
Publication date
2013
Language
English
ISBN 10 
3319023799
ISBN 13 
9783319023793
Binding
Paperback

Other Popular Editions of the Same Title

9783319023779: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Featured Edition

ISBN 10:  3319023772 ISBN 13:  9783319023779
Publisher: Springer, 2013
Hardcover