Items related to Three-Dimensional Integration and Modeling: A Revolution...

Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics) - Softcover

 
9783031005756: Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)

Synopsis

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

"synopsis" may belong to another edition of this title.

About the Author

Jong-Hoon Lee received the B.S. Degree in electrical engineering from The Pennsylvania State University, University Park, with high honor in the spring of 2001. He joined the electrical engineering at The Georgia Institute of Technology, in the fall of 2001 and received an M.S. degree in the fall of 2004 and a Ph.D. in the summer of 2007 under the advice of Prof. Manos M. Tentzeris. Dr. Lee is now the senior CAE engineer at RFMD in the design integration department. His research interests are SOP and SIP packaging technologies for microwave/mmW systems, passive/active circuits for RF/wireless systems, DSP-based predictors to improve the computational 108 THREE-DIMENSIONAL INTEGRATION efficiency of the simulation of highly resonant RF geometries. Jong-Hoon Lee also researches the development of the LTCC system-on-package (SOP) module for millimeter-wave wireless systems, FDTD/Spice interface, and active devices modeling with FDTD and MRTD. He was a member of the Georgia Tech ATHENA research group, NSF packaging research center, the Georgia Electronic Design Center, and Tau Beta Pi Honor association.

"About this title" may belong to another edition of this title.

Search results for Three-Dimensional Integration and Modeling: A Revolution...

Stock Image

Lee, Jong-Hoon; Tentzeris, Manos M.
Published by Springer, 2007
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Softcover

Seller: Ria Christie Collections, Uxbridge, United Kingdom

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. In English. Seller Inventory # ria9783031005756_new

Contact seller

Buy New

£ 31.84
Convert currency
Shipping: FREE
Within United Kingdom
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Stock Image

Lee, Jong-Hoon
Published by Springer 2007-12, 2007
ISBN 10: 3031005759 ISBN 13: 9783031005756
New PF

Seller: Chiron Media, Wallingford, United Kingdom

Seller rating 4 out of 5 stars 4-star rating, Learn more about seller ratings

PF. Condition: New. Seller Inventory # 6666-IUK-9783031005756

Contact seller

Buy New

£ 29.71
Convert currency
Shipping: £ 2.49
Within United Kingdom
Destination, rates & speeds

Quantity: 10 available

Add to basket

Seller Image

Manos M. Tentzeris
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Taschenbuch
Print on Demand

Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References 120 pp. Englisch. Seller Inventory # 9783031005756

Contact seller

Buy New

£ 31.44
Convert currency
Shipping: £ 9.51
From Germany to United Kingdom
Destination, rates & speeds

Quantity: 2 available

Add to basket

Seller Image

Manos M. Tentzeris
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Taschenbuch

Seller: AHA-BUCH GmbH, Einbeck, Germany

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References. Seller Inventory # 9783031005756

Contact seller

Buy New

£ 31.44
Convert currency
Shipping: £ 12.10
From Germany to United Kingdom
Destination, rates & speeds

Quantity: 1 available

Add to basket

Stock Image

Lee, Jong-Hoon; Tentzeris, Manos M.
Published by Springer, 2007
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Softcover
Print on Demand

Seller: Majestic Books, Hounslow, United Kingdom

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. Print on Demand. Seller Inventory # 401726020

Contact seller

Buy New

£ 41.02
Convert currency
Shipping: £ 3.35
Within United Kingdom
Destination, rates & speeds

Quantity: 4 available

Add to basket

Stock Image

Lee, Jong-Hoon; Tentzeris, Manos M.
Published by Springer, 2007
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Softcover

Seller: Books Puddle, New York, NY, U.S.A.

Seller rating 4 out of 5 stars 4-star rating, Learn more about seller ratings

Condition: New. 1st edition NO-PA16APR2015-KAP. Seller Inventory # 26394683803

Contact seller

Buy New

£ 40.52
Convert currency
Shipping: £ 6.66
From U.S.A. to United Kingdom
Destination, rates & speeds

Quantity: 4 available

Add to basket

Seller Image

Lee, Jong-Hoon|Tentzeris, Manos M.
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Softcover
Print on Demand

Seller: moluna, Greven, Germany

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as we. Seller Inventory # 608128996

Contact seller

Buy New

£ 29.12
Convert currency
Shipping: £ 21.61
From Germany to United Kingdom
Destination, rates & speeds

Quantity: Over 20 available

Add to basket

Stock Image

Lee, Jong-Hoon; Tentzeris, Manos M.
Published by Springer, 2007
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Softcover
Print on Demand

Seller: Biblios, Frankfurt am main, HESSE, Germany

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. PRINT ON DEMAND. Seller Inventory # 18394683793

Contact seller

Buy New

£ 44.20
Convert currency
Shipping: £ 6.87
From Germany to United Kingdom
Destination, rates & speeds

Quantity: 4 available

Add to basket

Seller Image

Manos M. Tentzeris
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Taschenbuch

Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Taschenbuch. Condition: Neu. Neuware -This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / ReferencesSpringer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 120 pp. Englisch. Seller Inventory # 9783031005756

Contact seller

Buy New

£ 31.44
Convert currency
Shipping: £ 30.27
From Germany to United Kingdom
Destination, rates & speeds

Quantity: 2 available

Add to basket

Stock Image

Lee, Jong-Hoon; Tentzeris, Manos M.
Published by Springer, 2007
ISBN 10: 3031005759 ISBN 13: 9783031005756
New Softcover

Seller: Lucky's Textbooks, Dallas, TX, U.S.A.

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

Condition: New. Seller Inventory # ABLIING23Mar3113020034868

Contact seller

Buy New

£ 31.71
Convert currency
Shipping: £ 55.54
From U.S.A. to United Kingdom
Destination, rates & speeds

Quantity: Over 20 available

Add to basket