Improving the quality and safety of microwavable convenience food products is a priority for manufacturers. Development of packaging and products for use in microwave ovens provides a comprehensive review of this important area. Written by a distinguished team of international contributors, the text discusses the principles, properties of ingredients, materials issues, design, product development and safety of packaging for use in microwaves. Passive and active packaging is discussed in detail with an emphasis on practical issues, in addition to the computer simulation of microwave heating of foods in both types of container.
Key Features: Comprehensively reviews the principles of microwave heating and ovens assessing the effect of food dielectric properties on heating uniformity. Thoroughly reviews microwave packaging materials and design including testing and regulatory issues. Features a seven page section of colour diagrams to show heat distributions.
Contents: Part 1 Principles: Electromagnetic basis of microwave heating; Influence of food geometry and dielectric properties on heating performance; Advanced topics in microwave heating uniformity; Microwave ovens; Measurements of dielectric properties of foods and associated materials; Microwave dielectric properties of foods and some other substances; Flavors and colors for microwave foods. Part 2 Microwave packaging materials and design: Rigid passive microwave packaging forms; Susceptors in microwave packaging; Shielding and field modification-thick metal films. Part 3 Product development, packaging and oven safety: Package and product development testing in a microwave oven; Regulatory issues in microwave packaging; Microwave oven safety. Part 4 Modeling of microwave heating: Modeling microwave heating in foods; Modeling the effects of active packaging of microwaved foods.
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Matthew Lorence and Peter Pesheck, of General Mills, each have over 25 years of experience working on microwave products focused on improving overall product performance. Matt Lorence works on package development while Peter Pesheck works primarily on dielectric properties, simulation, and problem-solving.
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