System-In-Package: Electrical and Layout Perspectives (Foundations and Trends (R) in Electronic Design Automation): 13 (Foundations and Trends® in Electronic Design Automation) - Softcover

He, Lei; Elassaad, Shauki; Shi, Yiyu; Hu, Yu; Yao, Wei

Softcover

ISBN 10: 1601984588 ISBN 13: 9781601984586

Publisher: now publishers Inc, 2011

Synopsis

With the increasing scalability of semiconductor processes, the higher level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as I/O (input/output cell) placement and routing for redistribution layer, escape, and substrate. System-in-Package: Electrical and Layout Perspectives is an invaluable reference for EDA researchers, professionals, and graduate students.

About this title

About the Author

Lei He is an associate professor in the Department of Electrical Engineering at the University of California, Los Angeles, where he was also awarded his PhD in computer science in 1999. His current research interests include computer-aided design of VLSI circuits and systems.

Edition details

• Publisher: now publishers Inc
• Publication date: 2011
• ISBN 10: 1601984588
• ISBN 13: 9781601984586
• Binding: Paperback
• Language: English
• Number of pages: 94